12-E27121-020-05 KIDDE FENWAL

The innovative semiconductor packaging technology scheme of the WBGYYDS team analyzed the application scenarios of power semiconductors in depth,and proposed four technologies for the two bottlenecks of heat dissipation and layout currently faced by power semiconductor device packaging,which won the unanimous approval of the judges.In June this year,they will represent the Chinese division in the Go Green global finals and compete with players from the other seven major divisions in the world for the championship.Team captain Yao Yilong said:”I am very happy to win the championship in China!Although the preparation process was not easy,Schneider Electric’s tutors gave us very professional guidance and let us learn a lot.This competition is very unforgettable,and we will prepare for the finals seriously.I also look forward to exchanging ideas with players from other regions.”

WBGYYDS战队创新的半导体封装技术方案深入分析了功率半导体的应用场景，针对当前功率半导体器件封装面临的散热和布局两大瓶颈提出了四项技术，赢得了评委的一致认可。今年6月，他们将代表中国赛区出战Go Green全球总决赛，与来自世界其他七大赛区的选手角逐总冠军。战队队长姚乙龙表示：“很开心能获得中国区冠军！虽然备战过程不易，但施耐德电气的导师给予我们非常专业的指导，让我们学习到很多。这次大赛非常难忘，我们会认真备战总决赛，也期待跟其他赛区的选手们交流切磋。”