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Germany’s congatec,a leading provider of embedded and edge computing technologies,has launched seven lower-power COM-HPC and COM Express modules based on 12th generation Intel Core IOTG mobile processors(codenamed Alder Lake).Using the latest Intel hybrid architecture,with performance cores(P-core)and energy efficiency cores(E-core);the processor base power consumption in its BGA package is only 15-28W,which enables engineers to use them for complete passive cooling embedded and edge computing platforms.This not only reduces the cost of expensive cooling solutions,but also increases the durability and reliability of the system design.

嵌入式和边缘计算技术的领先供应商德国康佳特(congatec)推出七款更低功耗且基于第12代英特尔酷睿IOTG移动处理器(代号Alder Lake）的COM-HPC和COM Express模块。采用最新的英特尔混合架构，具备性能核(P-core)与能效核(E-core)；其BGA封装的处理器基础能耗仅为15-28W，这使得工程师能够将它们用于完全被动散热的嵌入式和边缘计算平台。这不仅减少了需要昂贵成本的散热方案费用，还增进了系统设计的持久性及可靠性。