April 27,2018–At HANNOVER MESSE 2018,more than 20 international organizations and industry vendors jointly announced the”Time-Sensitive Networking(TSN)+OPC Unified Architecture(OPC UA)”smart manufacturing testbed covering six major industrial Internet scenarios.The stakeholders engaged in the testbed include the Alliance of Industrial Internet(AII),Avnu Alliance,Edge Computing Consortium(ECC),Fraunhofer FOKUS,Huawei,Schneider Electric,HollySys,National Instruments Corporation(NI),B&R Automation,TTTech,and Spirent Communications.Huawei’s TSN switches provide and low-latency industrial control network for the testbed.At the event,the testbed was demonstrated by simulating a range of real-life smart manufacturing conditions to show its technical highlight–TSN+OPC UA,which is the major driving force for new technologies such as predictive maintenance,data analytics,machine learning,and artificial intelligence(AI).
2018年4月27日——在2018年汉诺威工业博览会上,超过20个国际组织和行业供应商联合发布了涵盖六大工业互联网场景的“时间敏感网络(TSN)+OPC统一架构(OPC UA)”智能制造测试平台。参与测试平台的相关方包括工业互联网产业联盟(AII)、Avnu联盟、边缘计算联盟(ECC)、Fraunhofer FOKUS、华为、施耐德电气、和利时、美国国家仪器公司(NI)、贝加莱自动化、TTTech和思博伦通信。华为的TSN交换机为测试平台提供低延迟的工业控制网络。在此次活动中,通过模拟一系列现实生活中的智能制造条件来展示其测试平台,以展示其技术亮点–TSN+OPC UA,这是诸如预测性维护、数据分析、机器学习以及人工智能等新技术发展的主要推动力。
Elevating table for KTC BT-30 machine
Kohzu stage XM05-03 with sigma koki level plate
Anritsu power sensor MA72A
Philips RSM 011 NC9408600 10241
National matsushita VB-6075A CPU Card
Panasonic matsushita VB-5380EX SLT card A
Autocon I/O interface board 415-0607-902 rev.B