KSD1-08 KUKA

Smart Application:Virtual Measurement VM

Predict post-process metrology results using process flow and wafer status information,including upstream metrology and/or sensor data.Use artificial intelligence algorithms to model and analyze chip manufacturing process parameters and measurement results,including thickness,defect density/number,sheet resistance,and online electrical test results.

智能应用：虚拟量测VM

利用工艺流程和晶圆状态信息（包括upstream量测和/或传感器数据）预测工艺后量测结果。使用人工智能算法对芯片制造工艺参数和量测结果进行建模分析，包括厚度、缺陷密度/数量、方块电阻、以及在线电测试结果等。