Renesas Electronics(TSE:6723),a global supplier of semiconductor solutions,today announced the first I3C smart switching device RG3MxxB12 series for next-generation server motherboards and other infrastructure equipment—new chips that greatly improve scalability and reliability,while reducing the complexity of high-performance system designs,enabling I3C control plane networks with multiple initiator controllers(e.g.,CPU and baseboard management controller/BMC)to support full-speed operation by improving signal integrity and reducing capacitive loading Targets in large physical networks.The new products also support heterogeneous designs by providing IO level translation and protocol translation for mixed I2C/SMBus and I3C networks.
全球半导体解决方案供应商瑞萨电子(TSE:6723)今日宣布,率先推出面向下一代服务器主板和其它基础设施设备的I3C智能开关器件RG3MxxB12系列——全新芯片极大提升了可扩展性和可靠性,同时降低高性能系统设计的复杂性,使具有多个发起设备控制器(例如CPU和基板管理控制器/BMC)的I3C控制平面网络能够通过提高信号完整性和减少电容负载,来支持全速运行大型物理网络中的目标。新产品还通过为混合I2C/SMBus和I3C网络提供IO电平转换和协议转换来支持异构设计。
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