The new conga-HPC/cALP COM-HPC Client Size A module(95x120mm)and conga-TC670 COM Express Compact Type 6 module(95x95mm)offer 6 models based on energy efficient 12th Gen Intel Core processors and 1 cost-effective Celeron processor.Both series of modules support up to 64GB of ultra-fast DDR5 SO-DIMM memory up to 4,800 MT/s.Intel Core i7 and i5 processors include Intel Iris Xe integrated graphics,while i3 and Celeron processors include UHD graphics,providing outstanding graphics performance supporting up to 4 independent displays with up to 8K resolution.To be able to connect high-bandwidth peripherals,the COM-HPC module supports up to 16 PCIe Gen 4 and 8 PCIe Gen 3 lanes,plus up to 2 Thunderbolt ports.COM Express modules have up to 8 PCIe Gen 4 and 8 PCIe Gen 3 lanes.Both products can be equipped with an ultra-fast NVMe SSD and connect additional storage devices via 2 SATAGen3 ports.On the networking side,the COM-HPC module has 2x 2.5GbE and the COM Express module has 1x 2.5GbE,both support TSN.In terms of sound,the COM-HPC module provides SoundWire,HDA,and I2S,while the COM Express module provides HDA interfaces.The carrier support kit for each module supports all major real-time operating systems,including Hypervisor from Real-Time Systems,Inc.,as well as Linux,Windows and Android.
新款conga-HPC/cALP COM-HPC Client Size A模块(95x120mm)和conga-TC670 COM Express Compact Type 6模块(95x95mm)提供6款基于高能效第12代英特尔酷睿处理器和1款高性价比的赛扬处理器。两个系列的模块支持最多64GB,高达4,800 MT/s的超快DDR5 SO-DIMM内存。英特尔酷睿i7和i5处理器内含英特尔锐炬Xe集成显卡,而i3和赛扬处理器内含UHD显卡,提供出色图形性能可支持最多4个独立显示屏,最高8K分辨率。为了能够连接大带宽的外设,COM-HPC模块支持最多16个PCIe Gen 4和8个PCIe Gen 3通道,另有最多2个Thunderbolt接口。COM Express模块则具有最多8个PCIe Gen 4和8个PCIe Gen 3通道。两类产品都可选配超高速NVMe SSD,并通过2个SATAGen3接口连接额外的存储设备。在网络方面,COM-HPC模块具有2个2.5GbE,而COM Express模块有1个2.5GbE,两者均支持TSN。声音方面,COM-HPC模块提供SoundWire、HDA、I2S,而COM Express模块提供HDA接口。各模块的载板支持套件支持所有主流的实时操作系统,包括Real-Time Systems公司的Hypervisor,以及Linux,、Windows和Android。
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